Microstructure and thermal expansion of copper-based amorphous alloys during structural relaxation
17
TG146.1+1(金属学与热处理)
This work was financially supported by the Principal Fund of Xi”an Technological University, China Grant 0852-302021407
2020-04-10(万方平台首次上网日期,不代表论文的发表时间)
共7页
8-14