Numerical simulation of die filling behavior of AZ91D in the semisolid process
7
TG249.2;TP391.9(铸造)
The study was financially supported by both the National High Technical Research and Development Program of China2009AA03Z534;the Nation Basic Research Program of China2006CB605203;the International Cooperation in Technical Research and Development Program of China2009DFB 50210
2010-07-28(万方平台首次上网日期,不代表论文的发表时间)
共5页
127-131