Nanotopography Impact in Shallow Trench Isolation Chemical Mechanical Polishing-Dependence on Slurry Characteristics
mechanical polishing、grain size、silicon wafers
22
TG175(金属学与热处理)
the Korea Ministry of Science & Technology through the National Research Laboratory NRL program,Hynix Semiconductor Inc. and Sumitomo Mitsubishi Silicon Corp
2005-09-08(万方平台首次上网日期,不代表论文的发表时间)
共4页
1-4