Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability
Solder Joint Reliability、thermodynamic calculation、solder joint、intermetallic compound、rare earth element La、thermal fatigue life、diffusion kinetics、limited value、driving force、range of
20
TG146.1;TG404(金属学与热处理)
the Association of International Education of Japan
2008-01-21(万方平台首次上网日期,不代表论文的发表时间)
共4页
128-131