A New Activation Method for Electroless Metal Plating: Palladium Laden via Bonding with Self-Assembly Monolayers
palladium chemisorption、electroless copper plating、palladium chloride、silicon wafer、copper film、amino group
13
O6(化学)
国家自然科学基金69890220;Promotional Foundation of Ministry of Education of China for excellent youth teacher2000;Open Project Foundation of Laboratory of Solid State Microstructures of Nanjing University
2004-01-08(万方平台首次上网日期,不代表论文的发表时间)
共2页
687-688