Microstructure and mechanical property of Sn-Ag-Cu solder material
scanning electron microscope、intermetallic compound、interfacial properties、mechanical properties、mechanical property、surface morphology、creep resistance、aging time
36
TG1;TQ1
This study was financially supported by the Chinese Universities Scientific Fund2013RC0402;the Science & Technology Planning Project of Jinan City,China201401056;the Natural Science Foundation of Shanxi Province,China2013011023-5;the Taiyuan University of Science & Technology Doctoral Fund20122029
2017-04-26(万方平台首次上网日期,不代表论文的发表时间)
共5页
193-197