Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder
intermetallic compounds、rapid solidification、solidification rate、surface area、the growth
25
TG146(金属学与热处理)
国家自然科学基金50401003;天津市自然科学基金033608811;Fok Ying Tong Education Foundation104015
2006-09-19(万方平台首次上网日期,不代表论文的发表时间)
共6页
365-370