Promising electroplating solution for facile fabrication of Cu quantum point contacts

机标关键词：point contacts、electroplating solution、statistical analysis、type of

所属期刊栏目：10

分类号：O4 ;X13

资助基金：the National Natural Science Foundation of China.21503179,21403181,61573295,21522508,21673195,21533006,and 61071010;the National Basic Research Program of China2015CB932300;the Natural Science Foundation of Fujian Province2016J05162;the Fundamental Research Funds for the Central Universities in ChinaXiamen University,.20720170035 and 20720160092;the Young Thousand Talent Project of China

在线出版日期：2017-09-30（万方平台首次上网日期，不代表论文的发表时间）

页数：共10页

页码：3314-3323