Fracture mechanics analysis on Smart-Cut(R) technology. Part 1: Effects of stiffening wafer and defect interaction
Smart-Cut、mechanics analysis、Fracture、singular integral equation、stress intensity factors、interaction、integral transform、numerical results、internal pressure、fracture、technology、required、in order、examine、SOI、energy、Cauchy、plays、paper、high
25
O3(力学)
the Australian Research Council ARC;国家自然科学基金10525210;10732050;国家重点基础研究发展规划973计划2004CB619303;BG, HYL, and YWM are, respectively, Postdoctoral Fellow, Research Fellow;the ARC and tenable at the University of Sydney
2009-04-24(万方平台首次上网日期,不代表论文的发表时间)
共9页
73-81