Characterization of Interface Strength as Function of Temperature and Moisture Conditions
moisture content、interface fracture toughness、Moisture Sensitivity、strength parameter、production process、moulding compounds、interface behavior、fracture mechanics、surface treatment、numerical methods、adhesion strength、bending test
7
TN305.94(半导体技术)
2007-04-10(万方平台首次上网日期,不代表论文的发表时间)
共7页
16-22