New IC package, assembly technique by means of a ”blind” alignment ”flip-chip” method and assembling facilities
@@ In spite of a long period of the development ofmicroelectronic components base, the problem of the creation of IC package design, providing minimal area losses in contrast with area of a chip, remains unsolved ”1”Area losses can be described by the parameter P,which is equal to the ratio between the package area in plan and the chip area:
long period
4
P31
2005-08-18(万方平台首次上网日期,不代表论文的发表时间)
共4页
1-4